Datasheet 3D Model

AE413RAD Series

Outgassing Compliant Chip Inductors

The AE413RAD Series is not recommended for new designs, but existing customers will continue to be supported. As an alternative, we recommend the AR413RAD Series which is a drop-in replacement.

This robust version of Coilcraft’s standard 1008HQ series features high temperature materials that pass NASA low outgassing specifications and allow operation in ambient temperatures up to 155°C.
The standard tin-lead (Sn-Pb) terminations over leach-resistant base metalization ensures the best possible board adhesion.

All parts are qualified and compliant with MIL-STD-981 Family 50, Class S.

Looking for the commercial version of this part? See Coilcraft 1008HQ Series
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Specifications

Electrical specifications at 25°C.

Part is wound on low profile coilform.

Part number 1 Inductance (nH) 2 Tolerance (%) Q min 3 SRF min (GHz) 4 DCR max (mΩ) 5 Imax (A)
AE413RAD3N0_PZ 3.0 5 57 @ 1000 MHz > 5.00 38 1.8
AE413RAD4N1_PZ 4.1 5 75 @ 1000 MHz > 5.00 50 1.8
AE413RAD7N8_PZ 7.8 5 51 @ 500 MHz 3.80 50 1.6
AE413RAD10N_PZ 10 5,2 60 @ 500 MHz 3.20 60 1.5
AE413RAD12N_PZ 12 5,2 57 @ 500 MHz 2.40 60 1.5
AE413RAD18N_PZ 18 5,2 62 @ 350 MHz 2.10 70 1.4
AE413RAD22N_PZ 22 5,2 62 @ 350 MHz 2.05 70 1.4
AE413RAD33N_PZ 33 5,2 49 @ 150 MHz 1.70 90 1.2
AE413RAD36N_PZ 36 5,2 57 @ 150 MHz 1.40 90 1.1
AE413RAD39N_PZ 39 5,2 45 @ 150 MHz 1.30 90 1.1
AE413RAD47N_PZ 47 5,2,1 45 @ 150 MHz 1.45 120 0.95
AE413RAD56N_PZ 56 5,2,1 43 @ 150 MHz 1.08 120 0.95
AE413RAD68N_PZ 68 5,2,1 54 @ 150 MHz 1.15 130 0.85
AE413RAD82N_PZ 82 5,2,1 54 @ 150 MHz 1.06 160 0.80
AE413RADR10_PZ 100 5,2,1 51 @ 150 MHz 0.82 160 0.80
Notes
  1. When ordering, please specify tolerance, termination and screening codes: e.g. AE413RADR10JPZ.
  2. Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
  4. SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft SMD-D test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.

Tolerance:

  • F = 1%
  • G = 2%
  • J = 5%

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
  • L = Silver-palladium-platinum-glass frit.

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

ae413rad_dim.PNG

General specification

Core Material:
Ceramic
Packaging:
2000/7″reel
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth.
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.