3D Model Datasheet

AE433PGA Series

Outgassing Compliant Power Inductors

AE433PGA Series features exceptionally low DCR; soft saturation.

High temperature materials allow operation in ambient temperatures up to 155°C.
Passes NASA low outgassing specifications.
Tin-lead (Sn-Pb) termination for the best possible board adhesion.
Passes vibration testing to 80 G and shock testing to 1000 G.
Tin-lead (63/37) over copper terminations. Other terminations available at additional cost.

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Electrical specifications at 25°C. Operating voltage 0 – 80 V

Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	DCR (mΩ) 3		SRF (MHz) 4		Isat (A) 5			Irms (A) 6
Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	typ	max	min	typ	10% drop	20% drop	30% drop	20°C rise	40°C rise
AE433PGA111MSZ	0.11	1.4	1.7	200	250	14.0	21.0	29.0	15.4	21.8
AE433PGA251MSZ	0.25	2.5	3.0	104	130	7.5	12.0	16.5	13.5	18.0
AE433PGA331MSZ	0.33	3.0	3.6	88	110	6.4	10.6	15.2	12.4	17.3
AE433PGA471MSZ	0.47	4.2	5.1	76	95	6.1	9.7	13.4	10.7	14.8
AE433PGA601MSZ	0.60	5.1	5.9	64	80	4.9	8.2	11.7	10.1	13.8
AE433PGA821MSZ	0.82	7.7	8.6	52	65	3.9	6.8	9.4	8.4	10.5
AE433PGA102MSZ	1.0	8.2	9.0	48	60	3.8	6.3	8.8	8.8	12.0
AE433PGA152MSZ	1.5	13.0	14.3	36	45	3.2	5.3	7.5	6.0	8.3
AE433PGA222MSZ	2.2	19.5	21.5	32	40	2.7	4.4	6.2	5.0	6.7
AE433PGA332MSZ	3.3	30.8	34.0	24	30	2.2	3.5	4.8	3.7	5.0
AE433PGA472MSZ	4.7	43.0	47.3	18	23	1.9	3.0	4.1	3.1	4.2
AE433PGA562MSZ	5.6	48.7	53.6	17	22	1.7	2.7	3.7	2.9	3.9
AE433PGA682MSZ	6.8	63.6	70.0	16	21	1.6	2.5	3.4	2.3	3.2
AE433PGA822MSZ	8.2	71.0	78.1	16	20	1.4	2.3	3.2	2.2	3.1

Notes

When ordering, please specify screening code: e.g. AE433PGA822MSZ.
Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
DCR measured on a micro-ohmmeter.
SRF measured using Agilent/HP 4395A or equivalent.
DC current at 25°C that causes the specified inductance drop from its value without current. Click for temperature derating information.
Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Click for temperature derating information.

Note:
Irms testing was performed on a 0.060” inch thick pcb with 4 oz copper traces optimized to minimize additional termperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.