Datasheet 3D Model
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ST235RAP111

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
Q min
@ 100 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
ST235RAP111JRZ 110 10 670 1.10 190
Notes
  1. When ordering, please specify termination and screening codes: e.g. ST235RAP821JRZ.
  2. Inductance measured using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Termination:

  • R = Matte tin over nickel over silver-platinum-glass frit.
  • Q = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • P = Tin-lead (63/37). (Special order, added cost)

Testing:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical Impedance vs Frequency

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

st235rap_dim.PNG

General specification

Core Material:
Ceramic
Weight:
0.7 – 1.3 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +150 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.